New Product | Johan High Performance Aluminum Foil Tape, the Best Choice for Electromagnetic Shielding

With the rapid development of technology, intelligent electronic products in today's era are becoming increasingly lightweight and thin. Whether it is foldable screens or lightweight straight board designs, they have led to extreme weight reduction and thinning needs. At the same time, shielding effectiveness and grounding still need to be maintained at a high level. So how to achieve better electromagnetic shielding on thinner substrates? High performance aluminum foil tape is worth our in-depth research.

Copper foil tape is widely used in the market now. Although copper foil tape has good conductivity, it faces a bottleneck in lightweighting. To achieve this, we have upgraded from copper foil tape to aluminum foil tape. Aluminum foil tape, with its excellent conductivity and thermal conductivity, as well as lower weight, has achieved a design that is thinner and lighter than copper foil tape. Aluminum foil tape not only meets the growing demand for weight reduction and thinning in electronic products, but also maintains a high level of shielding and grounding performance. Therefore, it has been widely used in electronic products such as mobile phones.

Aluminum foil has a lower weight and is thinner and lighter

Suitable for various electromagnetic shielding and grounding applications

Balancing conductivity and adhesion performance

Conductive adhesive on non-woven fabric substrate can reduce curling

Product Features

Aluminum foil tape has a lower weight compared to copper foil, which is more conducive to achieving lightweight design of products

The electromagnetic shielding effectiveness of aluminum foil tape and copper foil tape is basically equivalent, both of which can meet the conventional shielding requirements

Product Application

Johan high-performance aluminum foil tape is widely used in various fields due to its excellent performance, including EMI shielding, electrostatic discharge (ESD) protection, PCB shielding, equipment grounding, mobile phone display FPC, camera module, mobile phone frame, mobile phone motherboard and other key components manufacturing and assembly processes.