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EMI Gasket
Home> Products >  Customized Production >  EMI Gasket

Conductive Sponge Foam Gasket for EMI RF Shielding With Adhesive Backing ESD Safe Die Cut Electrical and Grounding

Introduction

Introduction

In today's rapidly evolving electronics landscape, electromagnetic interference and radio frequency disruption pose significant challenges for manufacturers across diverse industries. The Conductive Sponge Foam Gasket for EMI RF Shielding With Adhesive Backing ESD Safe Die Cut Electrical and Grounding represents a cutting-edge solution designed to address these critical concerns while maintaining operational efficiency and reliability. This innovative gasket technology combines advanced conductive materials with precision engineering to deliver superior electromagnetic compatibility and electrostatic discharge protection.

Professional engineers and procurement specialists worldwide recognize the importance of implementing robust shielding solutions that can seamlessly integrate into complex electronic assemblies. Our conductive sponge foam gaskets offer an optimal balance of flexibility, conductivity, and durability, making them an indispensable component for applications requiring reliable electromagnetic interference mitigation and radio frequency containment.

Product Overview

The Conductive Sponge Foam Gasket for EMI RF Shielding With Adhesive Backing ESD Safe Die Cut Electrical and Grounding incorporates state-of-the-art foam technology infused with conductive particles to create an exceptional sealing and shielding solution. This specialized gasket material features a carefully engineered cellular structure that provides excellent compression characteristics while maintaining consistent electrical conductivity across the entire sealing interface.

The integrated adhesive backing system ensures reliable installation and long-term adhesion to various substrate materials commonly found in electronic enclosures. The electrostatic discharge safe formulation prevents static buildup and discharge events that could potentially damage sensitive electronic components. Each gasket undergoes precision die cutting processes to achieve exact dimensional tolerances and consistent edge quality, enabling optimal fitment in demanding applications.

The conductive foam matrix utilizes advanced polymer chemistry combined with strategically distributed conductive fillers to achieve superior electromagnetic shielding effectiveness across broad frequency ranges. This innovative material composition ensures consistent performance while maintaining the flexibility and compressibility essential for creating effective environmental seals.

Features & Benefits

Advanced Conductive Technology

The conductive sponge foam incorporates proprietary filler technology that creates multiple conductive pathways throughout the material matrix. This design approach ensures reliable electrical continuity even under varying compression loads and environmental conditions. The uniform distribution of conductive particles enables consistent shielding performance across the entire gasket surface, eliminating potential weak points that could compromise electromagnetic interference protection.

Superior Compression and Recovery Characteristics

The engineered foam structure provides excellent compression set resistance, allowing the gasket to maintain its sealing properties throughout extended service life. The material exhibits exceptional recovery characteristics after compression, ensuring consistent contact pressure and reliable electrical connections. This combination of flexibility and resilience makes the gasket suitable for applications involving frequent access or thermal cycling conditions.

Electrostatic Discharge Protection

The ESD safe formulation incorporates specialized additives that provide controlled conductivity levels, effectively dissipating static charges while preventing sudden discharge events. This feature protects sensitive electronic components from electrostatic damage during assembly, operation, and maintenance procedures. The controlled conductivity also enhances grounding effectiveness, contributing to overall system reliability and electromagnetic compatibility.

Precision Die Cutting Capabilities

Advanced die cutting technology enables the production of complex geometric shapes with exceptional dimensional accuracy and edge quality. This precision manufacturing approach ensures optimal fitment in tight tolerance applications while minimizing material waste and installation time. Custom die cutting capabilities accommodate unique design requirements and enable rapid prototyping for new product development initiatives.

Applications & Use Cases

The versatile nature of the Conductive Sponge Foam Gasket for EMI RF Shielding With Adhesive Backing ESD Safe Die Cut Electrical and Grounding makes it suitable for numerous applications across multiple industries. Telecommunications equipment manufacturers rely on these gaskets to maintain signal integrity and prevent interference between adjacent circuits and components. The gaskets effectively seal equipment enclosures while providing the necessary electromagnetic shielding to meet stringent regulatory requirements.

Medical device applications benefit from the ESD safe properties and reliable sealing performance, particularly in environments where electromagnetic compatibility is critical for patient safety and device functionality. The gaskets provide essential protection against radio frequency interference that could affect sensitive diagnostic and therapeutic equipment. The biocompatible material options available ensure compliance with medical device regulations and standards.

Aerospace and defense applications demand the highest levels of reliability and performance, making these conductive gaskets an ideal choice for mission-critical systems. The gaskets provide robust electromagnetic interference protection while withstanding extreme environmental conditions including temperature variations, vibration, and atmospheric pressure changes. The lightweight nature of the foam material contributes to overall weight reduction objectives in aerospace applications.

Consumer electronics manufacturers utilize these gaskets to address electromagnetic compatibility requirements while maintaining compact product designs. The thin profile and excellent compression characteristics enable integration into space-constrained applications without compromising performance. The gaskets effectively prevent electromagnetic interference between internal components and external radiation, ensuring regulatory compliance and optimal device performance.

Quality Control & Compliance

Rigorous quality control measures ensure that every Conductive Sponge Foam Gasket for EMI RF Shielding With Adhesive Backing ESD Safe Die Cut Electrical and Grounding meets demanding performance specifications and industry standards. Comprehensive testing protocols evaluate electrical conductivity, compression characteristics, adhesive strength, and environmental resistance to ensure consistent product quality. Advanced measurement systems monitor critical parameters throughout the manufacturing process to maintain tight tolerances and performance consistency.

Material certification programs verify compliance with international standards for electromagnetic compatibility, environmental safety, and material performance. Regular audits and validation testing ensure ongoing compliance with evolving regulatory requirements across different markets and applications. The quality management system incorporates continuous improvement initiatives to enhance product performance and manufacturing efficiency.

Environmental testing protocols validate gasket performance under various conditions including temperature cycling, humidity exposure, salt spray resistance, and ultraviolet radiation exposure. These comprehensive evaluations ensure reliable long-term performance in diverse operating environments. Material traceability systems enable complete documentation of raw material sources and manufacturing processes for applications requiring detailed quality records.

Customization & Branding Options

Extensive customization capabilities enable the development of tailored solutions that meet specific application requirements and performance objectives. Custom formulations can optimize material properties such as conductivity levels, compression characteristics, temperature resistance, and chemical compatibility. These specialized formulations address unique environmental conditions or performance requirements that standard products cannot accommodate.

Advanced die cutting and fabrication services support complex geometric requirements and multi-component assemblies. Custom tooling development enables high-volume production of intricate shapes while maintaining dimensional accuracy and edge quality. Prototype development services facilitate rapid evaluation of new designs and enable optimization before full-scale production implementation.

Private labeling and branding options allow distributors and system integrators to offer customized solutions under their own brand identity. Packaging customization includes specialized labeling, documentation, and presentation options that align with customer branding requirements. Technical documentation and certification support services assist with product qualification and regulatory approval processes.

Packaging & Logistics Support

Comprehensive packaging solutions protect gasket integrity during transportation and storage while facilitating efficient handling and inventory management. Specialized packaging materials and configurations prevent contamination, physical damage, and environmental degradation. Anti-static packaging options provide additional protection for ESD sensitive applications and ensure product quality throughout the supply chain.

Flexible packaging formats accommodate various order quantities and customer preferences, from individual piece packaging to bulk shipment configurations. Custom packaging options include specialized containers, protective inserts, and identification systems that streamline receiving and inventory processes. Environmental protection features ensure product stability during extended storage periods and varying environmental conditions.

Global logistics capabilities enable efficient distribution to international markets through established shipping networks and customs clearance procedures. Regional distribution centers provide localized inventory management and rapid fulfillment services to minimize lead times and transportation costs. Advanced tracking systems provide real-time visibility into shipment status and delivery schedules.

Why Choose Us

With over two decades of experience in specialized foam manufacturing and electromagnetic compatibility solutions, our company has established a reputation for innovation and reliability in the global electronics industry. Our extensive collaboration with leading technology companies across multiple continents has resulted in advanced product development capabilities and deep understanding of evolving market requirements. This experience enables us to deliver sophisticated solutions that meet the most demanding performance specifications.

Our commitment to continuous improvement and technological advancement drives ongoing investment in research and development initiatives that keep our products at the forefront of industry innovation. Advanced manufacturing facilities equipped with state-of-the-art processing equipment ensure consistent product quality and reliable supply chain performance. Comprehensive technical support services assist customers with product selection, application engineering, and performance optimization.

As a recognized metal packaging manufacturer with expertise spanning multiple material technologies, we understand the complexities of modern electronic system design and the critical role that effective shielding solutions play in overall system performance. Our position as a trusted custom tin box supplier and OEM tin packaging solutions provider demonstrates our commitment to quality and customer satisfaction across diverse applications. This multi-industry expertise enables us to offer innovative solutions that address unique challenges and requirements.

Conclusion

The Conductive Sponge Foam Gasket for EMI RF Shielding With Adhesive Backing ESD Safe Die Cut Electrical and Grounding represents a comprehensive solution for modern electromagnetic compatibility challenges. Its innovative design combines superior shielding performance with practical installation features and long-term reliability. The advanced material technology ensures consistent performance across diverse applications while meeting stringent quality and safety requirements. This gasket solution enables engineers and manufacturers to achieve optimal electromagnetic compatibility while maintaining design flexibility and cost-effectiveness in their electronic systems.

Product Description

This FOF is made of thin conductive fabric or film and PU Foam. It is used for grounding and shielding application. With its unique structure design, it can keep certain rebound to ensure close contact even after heavy compression Issueed: Dec,2024

Application
Long term and High reliable grounding between metal case/shielding-can and PCB in game-console
Shielding and grounding around microchip to replace shielding-can frame in smart phones
Shielding and grounding of I/O interface in server/base station or equipment
Conductive Film/Fabric
Type
thickness(mm)
Surface Resistivity
shielding(10Mhz-3GHz)
Ni/Cu Polyester Taffeta
0.08/0.12
<0.05ohms
>70dB
Coer Foam
Type
Compression Set
Color
Flame Retardant(UL 94)
Urethane/Soft silicone
5-10%
Black
V0/HF-1
PSA Tape
Type
Thickness(mm)
Z  Resistivity(ohm)
Adhesion(N /25mm)
Conductive double sides adhesive tape
0.08
<0.05
>12
Conductive Sponge Foam Gasket for EMI RF Shielding With Adhesive Backing ESD Safe Die Cut Electrical and Grounding factory
Storage condition:

One year when placed in the warehouse with the temperature between 18-26℃ and humidity
between 45-65%. Follow the first-in-first-out rule
Operation temperature:
-20 to 80℃ for long term and performance may be compromised for excessive high or low temperature.

Company Profile

Established in 2011, Shenzhen Johan Material Technology Co., Ltd. is a pioneering material company specializing in EMI/EMCsolutions. Our forte lies in the production of shielding and grounding gaskets and custom-designed, high-performance tapes. In 2022, we earned the prestigious national-level specialized and innovative small giant certification.

We cater primarily to the consumer electronics, communication networks, and emerging energy vehicle sectors. To back ourcommitment to quality and innovation, we have established a national production base across four strategic locations:

1. A 1,000-square-meter new material formula R&D center in Shenzhen.
2. A 2,000-square-meter innovative grounding wrapping production plant in Dongguan.
3. A 10,000-square-meter conductive shielding tape coating plant in Hunan.
4. A 1,000-square-meter magnetron sputtering continuous gold/tin plating plant in Shandong.

As the only vertically integrated integrator in China offering electroplating, coating, and processing capabilities, we strive to become a leading innovator and provider of core values within the materials industry chain. Our ultimate goal is to be a long-term trusted solution provider and partner for our customers in addressing their challenges.
Conductive Sponge Foam Gasket for EMI RF Shielding With Adhesive Backing ESD Safe Die Cut Electrical and Grounding details
Our exhibition
Our company actively pursues global market expansion through strategic participation in premier international exhibitions including CES and Electronics China. We are aggressively penetrating diverse sectors such as consumer electronics, new energy vehicles, communication equipment, and emerging fields including AI and IoT. Having successfully commenced deliveries in these new domains, we maintain strong momentum in continuous exploration of additional overseas markets. Our dynamic approach demonstrates unwavering commitment to global business development and technological innovation. 
Conductive Sponge Foam Gasket for EMI RF Shielding With Adhesive Backing ESD Safe Die Cut Electrical and Grounding supplier

Invention Patent

Based on our strong R&D capabilities, we possess 12 Chinese and 2 U.S. invention patents, plus 30 utility model patents. These patented technologies are applied across our core product lines, including innovative grounding foam and high-performance custom tapes, demonstrating our industry leadership in EMI/EMC materials and providing customers with reliable, proprietary solutions.
Conductive Sponge Foam Gasket for EMI RF Shielding With Adhesive Backing ESD Safe Die Cut Electrical and Grounding manufacture
Conductive Sponge Foam Gasket for EMI RF Shielding With Adhesive Backing ESD Safe Die Cut Electrical and Grounding factory
Conductive Sponge Foam Gasket for EMI RF Shielding With Adhesive Backing ESD Safe Die Cut Electrical and Grounding manufacture
Conductive Sponge Foam Gasket for EMI RF Shielding With Adhesive Backing ESD Safe Die Cut Electrical and Grounding factory

System certification

Our company maintains a comprehensive quality management system, certified to ISO 9001:2015 (SGS) for quality assurance and IATF16949 (SGS) for automotive industry standards. We are also certified to ISO 14001 (SGS) for environmental management and QC 080000 (SGS) for hazardous substance process control. These certifications demonstrate our commitment to delivering reliable, high-quality products through systematic process control and continuous improvement.
Conductive Sponge Foam Gasket for EMI RF Shielding With Adhesive Backing ESD Safe Die Cut Electrical and Grounding factory
Conductive Sponge Foam Gasket for EMI RF Shielding With Adhesive Backing ESD Safe Die Cut Electrical and Grounding factory
Conductive Sponge Foam Gasket for EMI RF Shielding With Adhesive Backing ESD Safe Die Cut Electrical and Grounding supplier
Conductive Sponge Foam Gasket for EMI RF Shielding With Adhesive Backing ESD Safe Die Cut Electrical and Grounding factory

FAQ

1. who are we?
We are based in Guangdong, China, start from 2011,sell to South Asia(10.00%). There are total about 101-200 people in our office.

2. how can we guarantee quality?
Always a pre-production sample before mass production;
Always final Inspection before shipment;

3.what can you buy from us?
Shielding tape,Adhesive tapes,Waterproof and breathable membrane,Customized production,Raw material die-cutting

4. why should you buy from us not from other suppliers?
Shenzhen Johan Material Tech Co., Ltd. was established in 2011, and is an innovative national high-tech enterprise providing
innovative EMC (electromagnetic compatibility) grounding elastomers and customized tape solutions for the electronics indus

5. what services can we provide?
Accepted Delivery Terms: FOB,CFR,CIF,EXW,FAS,CIP,FCA,CPT,DEQ,DDP,DDU,Express Delivery,DAF,DES;
Accepted Payment Currency: USD,EUR,JPY,CAD,AUD,HKD,GBP,CNY,CHF;
Accepted Payment Type: T/T,L/C,D/P D/A,MoneyGram,Credit Card,PayPal,Western Union,Cash,Escrow;
Language Spoken: English,Chinese

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